THERMAL PASTE CPU  AKASA 3.5gr View larger

THERMAL PASTE CPU AKASA 3.5gr

AK-460

Silicone Technology Compound 

More details

8,77 €

All prices include VAT of 24%

Features

An evolution in silicone technology delivers outstanding thermal performance.Pro-grade Silicone technology provides a stable thermal compound which delivers a great thermal performance. Minimised resistance and maximised efficiency truly enables you to get a lot more from your cooler. RoHS compliant. 

Specifications
- Low thermal resistance for heat transfer, 0.16cm²C/W @60 um BLT 
- Maximum thermal conductivity, 3.3W/mK 
- Electrically non-conductive 
- Form: Non-curing 
- Specific gravity: 3.5 
- Operating temperature: -45°C to 200°C 
- Thermal resistance: 0.16cm²C/W @60um BLT 
- Volume: 3.5g

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THERMAL PASTE CPU  AKASA 3.5gr

THERMAL PASTE CPU AKASA 3.5gr

Silicone Technology Compound 

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